WiDY SenS 320 TE cooled qVGA SWIR cameras are idea for applications requiring wide dynamic range in a compact and very affordable camera. This camera is ideal for applications aligned with a 320X256 InGaAs sensor with 15 um pixel size. NIT SWIR cameras and sensors are all designed and manufactured in France using state-of-the-art InGaAs materials to creative proprietary sensors with ultra-high dynamic range of 120dB.
The WiDy family is a complete line of InGaAs cameras designed to perform in multiple applications with an unmatched performance at affordable prices. Equipped with NIT proprietary InGaAs sensors, the NIT WiDy 320 SWIR cameras offers natively High Dynamic Range and high-quality SWIR images in all lighting conditions. Easy to integrate thanks the different form factors, the WiDy 320 SWIR cameras are available in USB3.0 or CameraLink interfaces.
WiDy SenS 320 applications
320 x 256 pixels | |
Key features:
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Up to 1000 Hz | |
CameraLink™ or USB 3.0 | |
NSC2001T-SI | |
15um | |
TE Cooled | |
46x46x53mm | |
Down to 16x16 | |
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USB3.0, CameraLink | |
>70% | |
InGaAs | |
IWR/ITR, CDS, ROI | |
-120dB | |
-40°C to +65°C |
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(SWIR) Short-wave Infrared imaging is an advanced technique, used for producing images based on radiation within the electromagnetic spectrum. Infrared radiation is located between visible light and microwaves between 0.75 µm – 1mm wavelength. Infrared is split between 5 regions: Near-Infrared (NIR), Short-Wave Infrared (SWIR), Mid-Wave Infrared (MWIR), Long-Wave Infrared (LWIR), and Far Infrared (FIR). SWIR cameras can see even at night and under hard visible conditions lie clouds, smoke, or even dust. Another major benefit of SWIR imaging that is the ability to image through glass, great for inspection of products with no destruction.
InGaAs is an arcanum for the element composition of the material it makes (Indium, Gallium, Arsenide). NIT has developed and invested into a manufacturing line of InGaAs sensors using a unique and proprietary technology. InGaAs annoy absorbs IR light invisible to silicon and converts incident light into electrons digitized by the ROIC and the camera electronics. Adding this array to a ROIC, read-out integrated circuits, can be a challenging task in design and engineering. One of the critical steps is the 3D stacking of the photodiode array to the read-out circuit, for which NIT has developed a very innovative flip chip process ensuring the CMOS read out circuit at a sub-micron precision high yield and low cost of production.
SWIR imagers are used in a large number of applications including semiconductor inspection, laser alignment and beam profiling, hot glass inspection, security and surveillance, machine vision imaging, agricultural sensing, microscopy and life science imaging. Some examples are on our infrared and thermal imaging applications page (https://www.techimaging.com/applications/infrared-thermal-imaging-applications)