Fast S1K is Telops affordable science-grade near-infrared camera is highly sensitive from 0.9 to 1.7 µm with an InGaAs FPA. This unique swir camera is the fastest infared camera reaching unrivalled low-noise levels even at an astounding 1000 frame-per-second rate at full resoltion and up to 103,000 fps at 64 x 8 in subwindow mode. Either it is for fluorescent markers imaging, quality control of semiconductors, material sorting, gas detection, borehole samples analysis, solar cells characterization or space applications, the Fast S1K swir camera extend the boundaries of laboratory and industrial imaging.
Telops FAST S1K swir infrared InGaAs camera is designed to provide radiometic measurments of hot targets with optional temperature calibrations between 300 to 700°C. It is easy to install on WIndows platforms and presents a friendly user interface using the Reveal IR software Suite. Telops also includes MATLAB and Python intergration. Its multithreaded architecture is a key feature when processing in parallel complex algorithms, acquiring, visualizing, importing and exporting data in real time. Data processing includes real-time data output, real time scene temperature calibration, real time radiance calibration, customer calibration managment tools, time stamping, Teleops Automatic Exposure control (AEC), enhanced high dynamic rangne, and a motirized filter wheel.
Target applications include:
640 x 512 pixles | |||||||||||||||||
16GB or 32GB | |||||||||||||||||
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up to 1000Hz full frame | |||||||||||||||||
Gigabit Ethernet | |||||||||||||||||
InGaAs | |||||||||||||||||
InGaAs | |||||||||||||||||
20um | |||||||||||||||||
1 μs | |||||||||||||||||
13.8" X 7.8" X 6.9" | |||||||||||||||||
Subwindow Mode | |||||||||||||||||
GigE, Camera Link, HD-SDI | |||||||||||||||||
InGaAs | |||||||||||||||||
RAW, NUC, TEMP, RADIANCE | |||||||||||||||||
GigE, Camera Link, HD-SDI | |||||||||||||||||
-20C to +50°C |
(SWIR) Short-wave Infrared imaging is an advanced technique, used for producing images based on radiation within the electromagnetic spectrum. Infrared radiation is located between visible light and microwaves between 0.75 µm – 1mm wavelength. Infrared is split between 5 regions: Near-Infrared (NIR), Short-Wave Infrared (SWIR), Mid-Wave Infrared (MWIR), Long-Wave Infrared (LWIR), and Far Infrared (FIR). SWIR cameras can see even at night and under hard visible conditions lie clouds, smoke, or even dust. Another major benefit of SWIR imaging that is the ability to image through glass, great for inspection of products with no destruction.
InGaAs is an arcanum for the element composition of the material it makes (Indium, Gallium, Arsenide). NIT has developed and invested into a manufacturing line of InGaAs sensors using a unique and proprietary technology. InGaAs annoy absorbs IR light invisible to silicon and converts incident light into electrons digitized by the ROIC and the camera electronics. Adding this array to a ROIC, read-out integrated circuits, can be a challenging task in design and engineering. One of the critical steps is the 3D stacking of the photodiode array to the read-out circuit, for which NIT has developed a very innovative flip chip process ensuring the CMOS read out circuit at a sub-micron precision high yield and low cost of production.
SWIR imagers are used in a large number of applications including semiconductor inspection, laser alignment and beam profiling, hot glass inspection, security and surveillance, machine vision imaging, agricultural sensing, microscopy and life science imaging. Some examples are on our infrared and thermal imaging applications page.
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